Registration is officially open for RadTech 2024, the UV+EB Technology Conference & Exposition, taking place May 19-22, 2024 at the Hyatt Regency in Orlando, Florida, USA.
RadTech 2024 promises to be a groundbreaking gathering for professionals across various industries. The conference will feature a comprehensive technical program, focusing on both traditional and emerging applications of UV+EB technology. Key areas include printing, packaging, 3D printing, industrial applications, automotive technologies, batteries, wearables, coil coatings and more.
Event Highlights:
- Diverse Sessions and Expert Insights: Engage with a wide range of topics and gain invaluable insights from industry leaders and innovators.
- Sustainability and Efficiency: Discover how UV+EB technology is revolutionizing manufacturing, offering sustainable and efficient solutions for the global ink, coatings, and adhesive industries.
- Networking and Collaboration: Connect with the entire supply chain, from raw material suppliers to system integrators and end-users.
- Global Exhibition for UV+EB Industry: In addition to the diverse sessions and insightful talks, RadTech 2024 will host an extensive exhibition showcasing the latest innovations in UV+EB technology. This exhibition is a unique opportunity for attendees to experience first-hand the latest advancements, interact with product experts, and discover new tools and technologies that are driving the industry forward.
UV+EB Technology Benefits:
- Energy Efficiency: Learn about significant energy savings and rapid curing processes.
- Environmental Impact Reduction: Explore solvent-free materials that minimize VOCs, HAPs, and CO2 emissions.
- Enhanced Product Quality: Understand the contributions of UV+EB to durability, chemical resistance, and overall product longevity.
- Innovation and Versatility: Witness the adaptability of UV+EB technologies across different materials and applications.
- Economic Advantages: Realize the substantial economic benefits through savings in energy and materials, increased throughput, and reduced waste management.
Post time: Jan-31-2024
